Joint effort to improve performance and reliability of next-generation data centers with cutting-edge substrate technology
SEOUL, South Korea, July 22, 2024 /PRNewswire/ — Samsung Electro-Mechanics (SEMCO) today announced a collaboration with AMD (NASDAQ: AMD) to supply high-performance substrates for hyperscale data center computing applications. These substrates are manufactured at SEMCO’s main technology hub in Busan and its new state-of-the-art factory in Vietnam.
Samsung Electro-Mechanics Busan Factory Samsung Electro-Mechanics Vietnam Factory
Market research firm Prismark predicts that the semiconductor substrate market will grow at an average annual rate of approximately 7%, increasing from 15.2 trillion won in 2024 to 20 trillion won in 2028. SEMCO’s significant investment of 1.9 trillion won in its FCBGA fab underscores the company’s commitment to advancing its substrate technology and manufacturing capabilities to meet the highest industry standards and future technology needs.
SEMCO and AMD’s collaboration focuses on addressing the unique challenges of integrating multiple semiconductor chips (chiplets) onto one large substrate. Essential for CPU/GPU applications, these high-performance substrates have significantly more surface area and more layers, enabling the dense interconnects required for today’s advanced data centers. Compared to standard computer substrates, data center substrates are 10 times larger and have three times the layers, ensuring efficient power delivery and lossless signal integrity between chips. To address these challenges, SEMCO’s innovative manufacturing process mitigates issues such as warping and ensures high yields when mounting the chips.
SEMCO’s FCBGA factory is equipped with advanced real-time data collection and modeling capabilities, enabling the development of predictive manufacturing models that ensure signal, power, and mechanical integrity. This state-of-the-art facility positions SEMCO as a leader in the manufacturing of embedded boards with both passive components (capacitors and inductors) and active components (integrated circuits) to meet the future-proof needs of next-generation data centers.
“We are honored to be a strategic partner with AMD, a global leader in high-performance computing and AI semiconductor solutions,” said Kim Wontaek, executive vice president of the Strategic Marketing Center at Samsung Electro-Mechanics. “Continued investments in advanced substrate solutions provide significant value to customers like AMD to address the evolving demands of data centers and other compute-intensive applications, from AI to automotive systems.” “At AMD, we are constantly pushing the frontier of innovation to meet our customers’ performance and efficiency needs,” said Scott Aylor, corporate vice president of Global Operations and Manufacturing Strategy at AMD. “Our leadership in chiplet technology enables AMD to deliver leadership performance, efficiency and flexibility across our CPU and data center GPU portfolios. Our continued investments with partners such as SEMCO underscore the efforts we are making to ensure we have the advanced substrate technologies and capabilities necessary to deliver the next generation of high-performance computing and AI products.”
About Samsung Electro-Mechanics
For over 50 years, Samsung Electro-Mechanics (SEMCO) has been a leader in the development and manufacturing of a wide range of mechanical and high-tech electronic components. Founded in 1973, SEMCO has grown into a world-class company supplying essential electronic components to industries around the world. Our product portfolio includes chip components, communications modules and boards, and optical components to address next-generation design challenges. Our employees are dedicated to innovating and manufacturing high-quality components that improve modern technology and everyday life. For more information, visit Samsung Electro-Mechanics.
Source: Samsung Electro-Mechanics
